BOBST Confirms Participation at Odyssey Expo 2025 in Atlanta, Featuring a Special Competence Center Event
Mex, Switzerland, 13 February 2025
BOBST, a global leader in packaging and converting solutions, is pleased to announce its participation at Odyssey Expo 2025, scheduled for May 7–9, 2025, at the Cobb Galleria Centre in Atlanta, Georgia. BOBST will be located at booth 215.
Odyssey Expo is the premier event for diecutting, diemaking, foil stamping, and specialty markets, offering attendees unparalleled educational sessions and live equipment demonstrations. BOBST will showcase its latest advancements in tooling, automation, connectivity, and sustainability, demonstrating how these innovations address the evolving needs of the packaging industry.
Rob McCann, Tooling Director at BOBST, expressed his enthusiasm for the event: "Odyssey Expo provides an exceptional platform to engage with industry professionals and highlight BOBST's cutting-edge tooling solutions. We look forward to demonstrating how our technologies enhance precision and efficiency, and support more sustainable converting, helping our customers thrive in a competitive market."
Attendees visiting BOBST’s booth can anticipate:
- Advanced Tooling Solutions – Presentations on the latest precision tooling designed to optimize productivity and reduce waste.
- Automation and Connectivity – Live demonstrations of BOBST Connect and TooLink, showcasing real-time monitoring and streamlined operations.
- Sustainability Initiatives – Insights into BOBST’s commitment to eco-conscious practices within the converting and packaging sectors.
Exclusive Competence Center Networking Event
In addition to its presence at Odyssey Expo, BOBST will host a special networking event at its Atlanta Competence Center on May 8, 2025. In collaboration with Carton Craft and other industry leaders, this event - “CONNECT: Innovators in Tooling and Die Cutting” - will feature industry insights, interactive demonstrations, and discussions on the latest advancements in tooling, die cutting, and connectivity.
Key highlights include:
- Welcome notes from industry leaders including BOBST, Carton Craft, and others
- Interactive presentations by BOBST experts, discussing advancements in tooling, die cutting, and connectivity.
- Live demonstrations of BOBST Connect and TooLink, showcasing their role in streamlining operations and maximizing productivity.
- Exclusive networking opportunities with industry peers, vendors, and customers.
- Odyssey Expo 2025, organized by the International Association of Diecutting and Diemaking (IADD), will take place at the Cobb Galleria Centre, conveniently located near major transportation routes and attractions.
Join BOBST at Odyssey Expo 2025 and the Competence Center event to experience the forefront of tooling and converting solutions firsthand.
The release can be downloaded here:
PR_BOBST_Odyssey-13-02-2025_ENG.docx
DOCX - 66 Kb
About BOBST
We are one of the world’s leading suppliers of substrate processing, printing and converting equipment and services for the label, flexible packaging, folding carton and corrugated board industries. Our vision is to shape the future of the packaging world based on four pillars: connectivity, digitalization, automation and sustainability.
Founded in 1890 by Joseph Bobst in Lausanne, Switzerland, BOBST has a presence in more than 50 countries, runs 21 production facilities in 12 countries and employs more than 6 300 people around the world. The firm recorded a consolidated turnover of CHF 1.960 billion for the year ended December 31, 2023.
Press contact:
Gudrun Alex
BOBST PR Representative
Tel.: +49 211 58 58 66 66
Mobile: +49 160 48 41 439
Email: gudrun.alex@bobst.com
Katie Graham
Regional Marketing & Communications Manager
Bobst North America Inc.
Tel.: +1 973 226 8000
Mobile: +1 404 308 3480
Email: katie.graham@bobst.com
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YouTube: www.bobst.com/youtube